Emerson Process Management OCX 8800 Oxygen Equipment User Manual


 
Instruction Manual
IM-106-880C, OI
September 2009
9-29
Hazardous Area OCX 8800
REPAIR ELECTRONICS
HOUSING
Use the following procedures to remove damaged components from the
Hazardous Area OCX 8800 electronics housing and to install new
replacement parts. Disassemble the unit only as needed to replace damaged
components. Use the assembly procedures that apply to install replacement
parts and reassemble the unit.
Electronics Housing
Disassembly
Remove Cover
1. See Figure 9-24. Loosen screw (1) and slide locking clip (2) away from
cover (3). Retighten screw (1).
2. With two hands or strap wrench, turn cover (3) counterclockwise to
loosen. Unthread and remove cover.
3. Inspect cover gasket (4) for wear or damage. Replace cover gasket if
damaged.
Remove Flash PROM
1. Locate Flash PROM access port in electronics stack (5, Figure 9-24).
2. Use suitable IC removal tool to remove Flash PROM (6).
Remove LOI Module and Board
1. Remove three screws (7, Figure 9-24).
2. Carefully lift LOI module (8) from LOI board (9). Note the location of LOI
connector (10).
3. Remove two screws (11) and lockwashers (12). Remove LOI board (9).
Electrostatic discharge (ESD) protection is required to avoid damage to the electronic
circuits.