Chapter 1 13
Hardware Specifications and Configurations
Processor
Chipset
Item Specification
CPU type* • Intel® Core2™ Duo processor
• Intel® Core™2 Quad processor
• Pentium® dual-core Processor
*Dependent on model shipped.
Item Specification
Core logic
Ibex Peak package H57
• FCBGA package
• Package size: 27mm x 27mm
• Ball Count: 951
• Ball pitch: 0.7mm
Features
• PCI Express* Base Specification, Revision 2.0 support for up to eight ports.
• PCI Local Bus Specification, Revision 2.3 support for 33 MHz PCI operations
(supports up to four Req/Gnt pairs).
• ACPI Power Management Logic Support, Revision 3.0b
• Enhanced DMA controller, interrupt controller, and timer functions
• Integrated Serial ATA host controllers with independent DMA operation on up to
six ports.
• FIS-based Port Multiplier support on SATA Ports 4 and 5 in AHCI/RAID mode.
• USB host interface with support for up to fourteen USB ports; two EHCI high-
speed USB 2.0 Host controllers, 2 rate matching hubs, seven UHCI host
controllers; o Integrated 10/100/1000 Gigabit Ethernet MAC with System
Defense
• System Management Bus (SMBus) Specification, Version 2.0 with additional
support for I2C devices
• Supports Intel® High Definition Audio
• Supports Intel® Matrix Storage Technology
• Supports Intel® Active Management Technology
• Supports Intel® Virtualization Technology for Directed I/O
• Supports Intel® Trusted Execution Technology
• Dual Channel NAND Interface supporting 1.8V ONFi* 2.0 compliant NAND
• Supports buffered mode generating extra clocks from CK505 timer.
•
• Low Pin Count (LPC) interface
• Firmware Hub (FWH) interface support
• Serial Peripheral Interface (SPI) support
• Intel® Quiet System Technology (Desktop only)
• Intel® Anti-Theft Technology
• Integrated TPM 1.2
• JTAG Boundary Scan support
CPU Package
• LGA1156
CPU Core Voltage
• 95W
